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Storage continues to be one of the major cost components of today's infrastructure deployments. Thin technology, including thin provisioning, offers efficiency benefits that can significantly reduce both capital and operational costs. However, implementations of thin technologies differ with the storage vendors. This Edison Group report looks at thin provisioning technology from the major storage vendors in today's marketplace and compares the thin implementations from seven storage array platforms, including Hewlett-Packard's 3PAR storage arrays.

Sponsored by: HP and Intel® Xeon® processors

Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

Keywords
Hewlett-Packard Company, HP Thin Technologies: A Competitive Comparison, Storage, Thin Provisioning
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Hewlett-Packard Company
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